Taiwan Copper Foil (TCF) is a leading manufacturer of high-quality and advanced copper foil products, specializing in ultra-low loss materials for AI servers and high-frequency/high-speed communication applications. Established in 1980 as an investment by Mitsui Mining & Smelting Co., Ltd., TCF is dedicated to innovation, quality, and sustainability in the production of electrolytic copper foil for printed circuit boards and other advanced electronic components.
Services
Production of high-functionality copper foil for HDI and HSD applications
Development of ultra-low roughness copper foil (HVLP)
Manufacturing of reverse treated foil (RTF)
High-density interconnect (HDI) copper foil production
Copper foil solutions for AI servers, high-speed switches, and communication networks (100G, 400G, 800G, 1.6T, 1600G)
Materials for infrastructure, mobile devices, automotive & industrial, and packaging substrates
Key Facts
First professional electrolytic copper foil factory for printed circuit boards in Taiwan.
Established in November 1980 by Mitsui Mining & Smelting Co., Ltd.
Products widely used in high-speed signal transmission, high-density interconnect, heat dissipation, and high-current substrates.
Focus on R&D for high-performance electronics and new energy technologies.
Commitment to technical leadership, service excellence, stable quality, and product diversity.
Adheres to quality, environmental, and occupational safety and health policies.
Incorporates a spirit of exploration and diverse technologies for a sustainable future.
Contact
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銅箔|台灣銅箔製造商|AI伺服器與高頻高速通訊應用材料 — 台灣銅箔, Taiwan Copper Foil, Ultra low loss material, HVLP, HVLP5, HVLP4, HVLP3, AI server material, High speed switch material, 100G network switch, 400G network switch, 800G network switch, 1.6T network switch, 1600G network switch, Mitsui copper foil, High speed digital copper foil, High Density Copper foil
銅箔|台灣銅箔製造商|AI伺服器與高頻高速通訊應用材料 — 台灣銅箔, Taiwan Copper Foil, Ultra low loss material, HVLP, HVLP5, HVLP4, HVLP3, AI server material, High speed switch material, 100G network switch, 400G network switch, 800G network switch, 1.6T network switch, 1600G network switch, Mitsui copper foil, High speed digital copper foil, High Density Copper foil
铜箔|台湾铜箔制造商|AI服务器与高频高速通信应用材料 — 本公司专注于研发高性能电子材料,涵盖 Ultra Low Loss 铜箔、HVLP 系列,以及应用于 AI 服务器、高速交换机和下一代通信设备的高频高速铜箔。
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